Panasonic To Open First-of-its-Kind Advanced Packaging Lab

CONTACT: Kristin Serna Panasonic System Solutions Company of North America – Process Automation PH: 847-495-6100 FAX: 847-495-6095 PFSAmarketing@us.panasonic.com

June 2007 - Buffalo Grove, IL - Panasonic System Solutions Company of North America – Process Automation (PSSNA-PA) will host a grand opening ceremony for their Advanced Packaging Lab June 7, 2007. The ceremony coincides with the annual joint meeting of IMAPS Chicago/Milwaukee and SMTA Great Lakes. Combining the meeting and lab tour provide a prime environment for learning about new trends in microelectronics packaging and materials as well as for discussing the latest assembly and failure analysis equipment with industry experts.

PSSNA-PA created the lab, located in the Buffalo Grove headquarters, to further enhance their global coverage of their customers' advanced packaging needs. The lab contains the latest in metrology and test equipment including: X-Ray, C-SAM, SEM, and EDS for post-assembly analysis. Gene Dunn, PSSNA-PA Microelectronics Engineering Manager, commented, "By complementing a cleanroom with state-of-the-art equipment, we're offering customers a truly productive microelectronic solution. For the first time in North America, customers can qualify their samples on high volume production equipment, not semi-automatic tools."

John Macrina, Electronics Assembly Group Manager, added "Our customers are under increasing pressure to get their product designed, qualified, and out to market as quickly as possible. Panasonic continues to expand our capabilities to meet these needs with the addition of complete packaging lab support with metrology, failure analysis and HVM tool qualification. Panasonic is committed to assisting customers to meet the ever changing needs to win and grow their business."

President Katsutoshi Kanzaki and Director Neal Okuda of Panasonic System Solutions – Process Automation Company in Japan are expected to attend the opening. The event will feature technical presentations on packaging topics such as 3D-packaging, dispensing, materials, failure analysis, and industry trends. There will also be demonstrations of flip chip assembly, plasma cleaning, stud bump bonding, and SMT assembly as well as of inspection/failure analysis equipment

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Panasonic System Solutions Company of North America – Process Automation, a North American source for electronic assembly equipment (SMT), software and technical support, provides total business systems solutions for electronic semiconductor and packaging companies in the global marketplace through one provider. PSSNA-PA is also a premier source for robotic and manual arc welding equipment to distributors, system integrators and end users.

For additional information: Panasonic System Solutions Company of North America – Process Automation, 909 Asbury Drive, Buffalo Grove, IL 60089. PFSAmarketing@us.panasonic.com PH: 847-495-6100. www.panasonicfa.com

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