Panasonic Highlights Back-End Packaging Solutions at Semicon West 2006

CONTACT: Frank Barney Panasonic System Solutions Company of North America – Process Automation PH: 847-495-6100 FAX: 847-495-6095 PFSAmarketing@us.panasonic.com

June 8, 2006 - Panasonic System Solutions – Process Automation Company, a global manufacturing leader known worldwide for innovation and quality, will showcase our full suite of back-end packaging solutions at Semicon West, July 11 -13 at the Moscone Center in San Francisco. Sales and engineering experts will be on hand to demonstrate our award winning products and answer any questions you may have.

  • IPAC - one footprint, four configurable modules: Flip Chip, Die Attach, Dispense and Pick & Place/Chipshooting.
  • Flip chip - the flexible head design adapts to C4, thermosonic and TC bonding applications - providing leading-edge packaging during continuous production. Ideal for medium to very fine pitch.
  • Plasma clean - ideal for all manufacturers and for all volume levels. Our patented parallel-plate technology delivers superior results for both etching and surface modification.
  • Die attach - multi-beam parallel processing ensures efficiency and multi-die capability offers flexibility. Realize nearly 3 times productivity than conventional die bonders with multi-nozzle bond head design.

We understand the challenges manufacturers face in today's marketplace and we welcome the opportunity to provide a solution to your toughest manufacturing challenge. We are experts in productivity. Our solutions will make you more productive, profitable and successful.

See our back-end packaging solutions live at SEMICON West 2006, July 11 - 13, Moscone Convention Center West, Level 1, San Francisco, Booth # 7857.

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Panasonic System Solutions Company of North America – Process Automation, a North American source for electronic assembly equipment (SMT), software and technical support, provides total business systems solutions for electronic semiconductor and packaging companies in the global marketplace through one provider. PSSNA-PA is also a premier source for robotic and manual arc welding equipment to distributors, system integrators and end users.

For additional information: Panasonic System Solutions Company of North America – Process Automation, 909 Asbury Drive, Buffalo Grove, IL 60089. PFSAmarketing@us.panasonic.com PH: 847-495-6100. www.panasonicfa.com

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