Panasonic Expands Total Solution Package, Process, and Materials at Semicon

CONTACT: Kristin Serna Panasonic Factory Solutions Company of America PH: 847-637-9600 FAX: 847-637-9601

July 2, 2013 (Rolling Meadows, IL) – Panasonic Factory Solutions Company of America will highlight its unique and expanded total package, process, and material solution for microelectronics manufacturers in booth 5552 at SEMICON West, being held at the Moscone Center in San Francisco, CA from July 9 through 11.

Recognized worldwide as a preeminent, continuously innovative and industry-leading provider of total solutions for electronics manufacturing, Panasonic will exhibit the latest process innovations of the highly productive bonder, the MDP-200—highlighting its process adaptation of interconnects for traditional gold-to-gold and a new, cost-effective copper-to-copper process. The booth will also include material innovations for thermal management and thin packaging with new coreless and low CTE materials.

Subject matter experts will be available to explain and collaborate with microelectronics professionals to help them better understand and explore how Panasonic can bring incredible insight, innovation, and added value to their process.


About Panasonic Factory Solutions Panasonic Factory Solutions Company of America, a North American source for electronic assembly equipment (SMT), software and technical support, provides total business systems solutions for electronic semiconductor and packaging companies in the global marketplace through one provider. The company is a unit of Panasonic Corporation of North America, which is the principal North American subsidiary of Panasonic Corporation.

For additional information: Panasonic Factory Solutions Company of America, 5201 Tollview Drive, Rolling Meadows, IL 60008. PH: 847-637-9600.

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